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XCZU7EG-1FBVB900E - AMD

Description: SoC FPGA XCZU7EG-1FBVB900E

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XCZU7EG-1FBVB900E - AMD PCB footprint - BGA - BGA - XCZU7EG-1FBVB900E
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XCZU7EG-1FBVB900E - AMD  - 3D model - BGA - XCZU7EG-1FBVB900E
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XCZU7EG-1FBVB900E Details

  • Manufacturer Part Number:

    XCZU7EG-1FBVB900E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B900

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU7EG-1FBVB900E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU7EG-1FBVB900E is approximately 26W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCZU7EG-1FBVB900E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx Signal Integrity Guidelines, use the IBIS-AMI model, and perform signal integrity analysis using tools like HyperLynx or Mentor Graphics. Additionally, consider using the built-in signal integrity features, such as the Transceiver Wizard, and following the Xilinx PCB Design Guidelines.
  • The maximum bandwidth of the XCZU7EG-1FBVB900E's transceivers is 32.75 Gbps per lane, with a total bandwidth of up to 1.6 Tbps for the entire device.

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XCZU7EG-1FBVB900E Overview

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