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XCZU7EG-2FBVB900I - AMD

Description: FPGA - Field Programmable Gate Array XCZU7EG-2FBVB900I

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XCZU7EG-2FBVB900I - AMD PCB footprint - BGA - BGA - FBVB900
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XCZU7EG-2FBVB900I - AMD  - 3D model - BGA - FBVB900
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XCZU7EG-2FBVB900I Details

  • Manufacturer Part Number:

    XCZU7EG-2FBVB900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B900

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU7EG-2FBVB900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU7EG-2FBVB900I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and following the Xilinx Power Management Guide.
  • The XCZU7EG-2FBVB900I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • Yes, the XCZU7EG-2FBVB900I supports high-speed serial interfaces like PCIe Gen3, Gen4, and Ethernet up to 25Gbps, making it suitable for high-bandwidth applications.
  • To ensure signal integrity and reduce noise, follow the Xilinx PCB Design Guide, use proper signal routing, and implement noise reduction techniques like shielding, grounding, and decoupling. Additionally, use the Xilinx Signal Integrity Tool to analyze and optimize your design.

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XCZU7EG-2FBVB900I Overview

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