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XCZU7EV-1FBVB900E - AMD

Description: XILINX - XCZU7EV-1FBVB900E - Microprocessor PSoC/MPSoC, Zynq Family UltraScale+ ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-900

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Symbol
XCZU7EV-1FBVB900E - AMD - PCB symbol
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PCB Footprints
XCZU7EV-1FBVB900E - AMD PCB footprint - BGA - BGA - FBVB900 Flip-Chip, Fine-Pitch BGA (XCZU4CG, XCZU4EG, XCZU4EV, XCZU5CG, XCZU5EG, and XCZU5EV)
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3D Models
XCZU7EV-1FBVB900E - AMD - 3D model - BGA - FBVB900 Flip-Chip, Fine-Pitch BGA (XCZU4CG, XCZU4EG, XCZU4EV, XCZU5CG, XCZU5EG, and XCZU5EV)
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XCZU7EV-1FBVB900E Details

  • Manufacturer Part Number:

    XCZU7EV-1FBVB900E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B900

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU7EV-1FBVB900E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU7EV-1FBVB900E is approximately 12W, depending on the operating frequency, voltage, and usage.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible.
  • The maximum operating frequency of the XCZU7EV-1FBVB900E is 550 MHz, but it can vary depending on the specific application and implementation.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR4 memory interface IP core, and follow the Xilinx UG583 (MIG User Guide) for implementation guidelines.
  • The maximum bandwidth of the PCIe interface on the XCZU7EV-1FBVB900E is 8 GT/s, which translates to approximately 64 Gbps.

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XCZU7EV-1FBVB900E Overview

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