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XCZU7EV-2FBVB900E - AMD

Description: MPSOC, ARM CORTEX-A53/R5, FCBGA-900; Product Range:Zynq Family UltraScale+ Series Microprocessors; CPU Speed:1.5GHz; Core Architecture:ARM Cortex-A53, ARM Cortex-R5; MPU Case Style:FCBGA; No. of Pins:900Pins; MPU Family:Zynq; MPU RoHS Compliant: Yes

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PCB Footprints
XCZU7EV-2FBVB900E - AMD PCB footprint - BGA - BGA - FBVB900-1
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XCZU7EV-2FBVB900E - AMD  - 3D model - BGA - FBVB900-1
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XCZU7EV-2FBVB900E Details

  • Manufacturer Part Number:

    XCZU7EV-2FBVB900E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    2.97 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU7EV-2FBVB900E Frequently Asked Questions (FAQs)

  • Xilinx provides a PCB design guide and layout recommendations in the UG583 document, which includes guidelines for signal integrity, power distribution, and thermal management.
  • Xilinx provides power estimation and optimization tools, such as the Xilinx Power Estimator (XPE) and the Vivado Power Analysis tool. These tools help estimate power consumption and provide suggestions for optimization.
  • Xilinx recommends following the thermal management guidelines in the UG583 document, which includes information on heat sink design, thermal interface materials, and airflow considerations.
  • Xilinx provides a secure boot mechanism, which includes features like authentication, encryption, and secure key storage. The UG580 document provides detailed information on secure boot implementation.
  • The ARM Cortex-A9 processors in the XCZU7EV have limitations on cache coherence, memory bandwidth, and interrupt handling. Xilinx provides documentation and application notes on using the processors effectively, including the UG585 document.

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XCZU7EV-2FBVB900E Overview

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