A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the XEB1201 away from high-current paths and ensure good airflow around the component.
Apply a conformal coating to the XEB1201 and surrounding components. Ensure the PCB is designed with a moisture-resistant finish and consider adding humidity-sensing components to monitor environmental conditions.
Use a reflow soldering profile with a peak temperature of 240°C to 250°C, and a dwell time of 30-60 seconds. Avoid wave soldering or hand soldering, as it may damage the component.
Yes, but ensure the XEB1201 is properly isolated from the high-voltage supply using suitable insulation and creepage distances. Consult the datasheet for specific guidelines on voltage isolation.
Use a thermal imaging camera to identify hotspots. Check for proper PCB layout, soldering, and component orientation. Verify the input voltage, current, and frequency are within specified ranges. Consult the datasheet and application notes for troubleshooting guides.
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XEB1201 Overview
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