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XEF232-1024-FB374-C40 - XMOS

Description: XMOS - XEF232-1024-FB374-C40 - MCU, 32BIT, XCORE, FBGA-374

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XEF232-1024-FB374-C40 - XMOS PCB footprint - BGA - BGA - *XEF232-1024-FB374-C40
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XEF232-1024-FB374-C40 - XMOS  - 3D model - BGA - *XEF232-1024-FB374-C40
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XEF232-1024-FB374-C40 Details

  • Manufacturer Part Number:

    XEF232-1024-FB374-C40

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    FBGA-374

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    XMOS Ltd

  • Has ADC:

    NO

  • Additional Feature:

    Speed Grade 2000 MIPS

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    XEF232

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PBGA-B374

  • Length:

    18 mm

  • Low Power Mode:

    YES

  • Number of I/O Lines:

    176

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    374

  • Number of Timers:

    40

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    70 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA374,21X21,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    1048576

  • ROM (words):

    4194304

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.36 mm

  • Speed:

    24 MHz

  • Supply Current-Max:

    1400 mA

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    18 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

XEF232-1024-FB374-C40 Frequently Asked Questions (FAQs)

  • XMOS provides a reference design and layout guidelines in their application notes and development kits. It's recommended to follow these guidelines to ensure optimal thermal performance and signal integrity.
  • XMOS provides power consumption estimates in the datasheet, but actual power consumption can vary depending on the application. Engineers can use XMOS's power estimation tools and optimize their firmware to minimize power consumption.
  • XMOS provides a range of debugging tools, including xTIMEcomposer and xSOFTip. Engineers can also use third-party debugging tools and follow XMOS's debugging guidelines to identify and resolve issues.
  • XMOS provides guidance on regulatory compliance in their documentation, and engineers should consult with regulatory experts to ensure their design meets relevant standards and regulations.
  • XMOS provides documentation on the XEF232's reliability and safety features, but engineers should carefully evaluate the device's limitations and consider additional safety measures, such as redundancy and fail-safes, for high-reliability or safety-critical applications.

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XEF232-1024-FB374-C40 Overview

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