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XF3M(1)-1215-1B - OMRON Electronics

Description: FPC/FFC Connector, Dual-sided Contact Models, 1.0 mm Pitch, 12 Contacts, Gold flash plating

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XF3M(1)-1215-1B - OMRON Electronics PCB footprint - Other - Other - XF3M(1)-1215-1B-2
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XF3M(1)-1215-1B - OMRON Electronics  - 3D model - Other - XF3M(1)-1215-1B-2
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XF3M(1)-1215-1B Details

  • Manufacturer Part Number:

    XF3M(1)-1215-1B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    OMRON Electronic Components

  • YTEOL:

    7.75

  • Board Mounting Option:

    SOLDER HOLDING POSTS

  • Body Breadth:

    0.079 inch

  • Body Depth:

    0.224 inch

  • Body Length:

    0.614 inch

  • Connector Type:

    FFC/FPC CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Finish Termination:

    NOT APPLICABLE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    50 mΩ

  • Contact Style:

    DUAL PRONG

  • Dielectric Withstanding Voltage:

    250VAC V

  • Durability:

    20 Cycles

  • Filter Feature:

    NO

  • Insulation Resistance:

    100000000 Ω

  • Insulator Color:

    NATURAL

  • Insulator Material:

    LIQUID CRYSTAL POLYMER

  • Mating Contact Pitch:

    0.039 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • PCB Contact Pattern:

    RECTANGULAR

  • Plating Thickness:

    FLASH inch

  • Rated Current (Signal):

    0.5 A

  • Reference Standard:

    UL

  • Terminal Pitch:

    0.9906 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    12

XF3M(1)-1215-1B Frequently Asked Questions (FAQs)

  • Omron recommends a PCB layout with a solid ground plane, minimal signal trace length, and a decoupling capacitor (e.g., 10nF) between VCC and GND to reduce noise and ensure stable operation.
  • Omron recommends mounting the device on a heat sink or a metal core PCB to dissipate heat. Ensure a minimum clearance of 1mm around the device for air flow. Operating temperature range is -40°C to 125°C.
  • Omron recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s or less to prevent thermal shock.
  • Yes, XF3M(1)-1215-1B is designed to withstand vibrations up to 10G (10-2000Hz). However, ensure proper mounting and secure the device to prevent mechanical stress.
  • Check the power supply voltage, signal connections, and PCB layout for errors. Verify that the device is properly soldered and mounted. Consult Omron's application notes and technical support for further assistance.

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XF3M(1)-1215-1B Overview

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