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XG8V-0831 - OMRON Electronics

Description: Headers & Wire Housings Plug Straight Term 8Contact AuPlating

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PCB Footprints
XG8V-0831 - OMRON Electronics PCB footprint - Header, Vertical - Header, Vertical - XG8V-0831
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3D Models
XG8V-0831 - OMRON Electronics  - 3D model - Header, Vertical - XG8V-0831
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XG8V-0831 Details

  • Manufacturer Part Number:

    XG8V-0831

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Factory Lead Time:

    9 Weeks, 1 Day

  • Manufacturer:

    OMRON Electronic Components

  • YTEOL:

    9.1

  • Body Breadth:

    0.11 inch

  • Body Depth:

    0.098 inch

  • Body Length:

    0.799 inch

  • Body/Shell Style:

    PLUG

  • Connector Type:

    BOARD CONNECTOR

  • Contact Finish Mating:

    AU ON NI

  • Contact Finish Termination:

    TIN

  • Contact Gender:

    MALE

  • Contact Material:

    BRASS

  • Contact Pattern:

    RECTANGULAR

  • Contact Resistance:

    20 mΩ

  • Contact Style:

    SQ PIN-SKT

  • Dielectric Withstanding Voltage:

    650VAC V

  • Filter Feature:

    NO

  • Insulation Resistance:

    1000000000 Ω

  • Insulator Color:

    BLACK

  • Insulator Material:

    GLASS FILLED POLYBUTYLENE TEREPHTHALATE

  • JESD-609 Code:

    e3

  • Mating Contact Pitch:

    0.1 inch

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    LOCKING

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number Of PCB Rows:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -55 °C

  • PCB Contact Pattern:

    RECTANGULAR

  • Plating Thickness:

    6u inch

  • Rated Current (Signal):

    3 A

  • Reference Standard:

    UL

  • Terminal Length:

    0.118 inch

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    8

XG8V-0831 Frequently Asked Questions (FAQs)

  • Omron recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Keep the PCB layout compact and avoid thermal bottlenecks.
  • Follow Omron's recommended soldering profile: 260°C peak temperature, 3°C/s ramp rate, and 30 seconds dwell time. Use a solder with a melting point above 217°C. Avoid excessive solder paste and ensure proper cleaning and drying.
  • The maximum allowable voltage drop is 1.5V. Exceeding this may lead to reduced relay life or failure. Ensure the power supply voltage is within the recommended range and the relay is properly sized for the application.
  • Yes, but with precautions. The relay is designed to withstand vibrations up to 10G (10-2000Hz) and shocks up to 100G (11ms). Ensure proper mounting and secure the relay to the PCB or chassis to prevent damage.
  • Use a shielded cable and connector, and ensure proper grounding of the relay and PCB. Keep the relay away from high-frequency components and antennas. Follow Omron's EMI reduction guidelines and consult relevant EMC standards.

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XG8V-0831 Overview

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