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XIO2200AZGW - Texas Instruments

Description: TEXAS INSTRUMENTS - XIO2200AZGW - BRIDGE, PCIX-PCI TRANSLATION, 176BGA

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PCB Footprints
XIO2200AZGW - Texas Instruments PCB footprint - BGA - BGA - ZGW(S-PBGA-N176)
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XIO2200AZGW - Texas Instruments  - 3D model - BGA - ZGW(S-PBGA-N176)
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XIO2200AZGW Details

  • Manufacturer Part Number:

    XIO2200AZGW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    BGA-176

  • Pin Count:

    176

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    100 MHz

  • Drive Interface Standard:

    IEEE1394; IEEE1394A

  • JESD-30 Code:

    S-PBGA-B176

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    176

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA176,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    1.65 V

  • Supply Voltage-Min:

    1.35 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

XIO2200AZGW Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the XIO2200AZGW close to the power source and use short, wide traces for power and ground connections.
  • Use a reliable clock source, ensure proper signal termination, and implement error checking and correction mechanisms, such as CRC and retries, to ensure reliable data transfer.
  • The XIO2200AZGW has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package.
  • Yes, but ensure the PCB is securely fastened and consider using a vibration-dampening material, such as a silicone adhesive, to reduce the risk of mechanical stress on the device.
  • Ensure power is applied to the device in the correct sequence (VCC, then VIO), and use a reset signal to initialize the device after power-up. Consult the datasheet for specific timing requirements.

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XIO2200AZGW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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