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XIO2213AZAY - Texas Instruments

Description: 1394 Interface IC PCI Express to 1394b OHCI Host Cntrlr

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PCB Footprints
XIO2213AZAY - Texas Instruments PCB footprint - BGA - BGA - ZAY (S-PBGA-N167)
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3D Models
XIO2213AZAY - Texas Instruments  - 3D model - BGA - ZAY (S-PBGA-N167)
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XIO2213AZAY Details

  • Manufacturer Part Number:

    XIO2213AZAY

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    BGA

  • Pin Count:

    167

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Additional Feature:

    IT ALSO NEED 3.3V I/O NOMINAL SUPPLY

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    98.304 MHz

  • Data Transfer Rate-Max:

    122.88 MBps

  • Drive Interface Standard:

    IEEE 1394; IEEE 1394A

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PBGA-B167

  • JESD-609 Code:

    e1

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    167

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA167,14X14,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.19 mm

  • Supply Voltage-Max:

    1.65 V

  • Supply Voltage-Min:

    1.35 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

XIO2213AZAY Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the XIO2213AZAY datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short, using a solid ground plane, and minimizing noise coupling. Additionally, ensure the device is placed near the connector to reduce signal loss.
  • The XIO2213AZAY requires a specific power sequencing to prevent damage. Apply VCC first, followed by V3P3, and then enable the device. When powering down, disable the device, then remove V3P3, and finally remove VCC. Refer to the datasheet for the recommended power sequencing diagram.
  • The maximum cable length supported by the XIO2213AZAY depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length below 1 meter for optimal performance. However, longer cable lengths may be possible with proper signal conditioning and termination.
  • The XIO2213AZAY can operate in either USB 3.0 or USB 2.0 mode. To configure the device, use the USB_CFG pin to select the desired mode. For USB 3.0 operation, tie the USB_CFG pin to VCC, and for USB 2.0 operation, tie it to GND. Refer to the datasheet for more information on the configuration options.
  • The XIO2213AZAY has a maximum junction temperature of 125°C. Ensure proper thermal design and heat dissipation to prevent overheating. Use thermal vias, thermal pads, and heat sinks as needed to keep the device within the recommended operating temperature range.

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XIO2213AZAY Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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