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XIO3130INMH - Texas Instruments

Description: PCI Interface IC Integrated PCI Express® (PCIe) 1:3 4-port 4-lane packet switch 196-NFBGA -40 to 85

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XIO3130INMH - Texas Instruments - PCB symbol
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PCB Footprints
XIO3130INMH - Texas Instruments PCB footprint - BGA - BGA - NMH0196A
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3D Models
XIO3130INMH - Texas Instruments - 3D model - BGA - NMH0196A
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XIO3130INMH Details

  • Manufacturer Part Number:

    XIO3130INMH

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    100 MHz

  • Data Transfer Rate-Max:

    250 MBps

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.65 V

  • Supply Voltage-Min:

    1.35 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

XIO3130INMH Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
  • Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow and avoid blocking airflow around the device. Follow the recommended thermal design guidelines in the datasheet.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and use a common-mode choke or ferrite bead on the input lines. Follow the recommended EMI and RFI mitigation guidelines in the datasheet.
  • Use the recommended input filter topology and component values provided in the datasheet. Adjust the filter components based on your specific input voltage, frequency, and noise requirements.
  • The device can operate with input voltages between 2.7V and 5.5V, but the output voltage and current capabilities may be affected. Consult the datasheet for specific performance characteristics at different input voltages.

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XIO3130INMH Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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