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XLMG1020YFFT - Texas Instruments

Description: Texas Instruments 5V, 7A/5A Low Side GaN Driver With 60MHz/1ns Speed 6-DSBGA -40 to 125

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XLMG1020YFFT - Texas Instruments - PCB symbol
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PCB Footprints
XLMG1020YFFT - Texas Instruments PCB footprint - BGA - BGA - YFF006
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3D Models
XLMG1020YFFT - Texas Instruments - 3D model - BGA - YFF006
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XLMG1020YFFT Details

  • Manufacturer Part Number:

    XLMG1020YFFT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DSBGA-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-02-23

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Built-in Protections:

    UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e1

  • Length:

    1.255 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.855 mm

XLMG1020YFFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Use a thermal pad or thermal interface material to improve heat dissipation. Ensure good airflow around the device and avoid blocking the thermal pads. Operate the device within the specified temperature range of -40°C to 125°C.
  • Power up the device in the following sequence: VDD, then VCC, and finally the input signals. This ensures proper device initialization and prevents latch-up or damage.
  • To enter power-down mode, set the EN pin low. Ensure all input signals are at a valid logic level before powering down. During power-down, the device consumes minimal power, but it may take some time to recover when re-enabled.
  • Use a shielded enclosure, and ensure the PCB is designed with EMI and RFI mitigation in mind. Use bypass capacitors and ferrite beads to filter out noise. Keep the device away from antennas and other EMI sources.

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XLMG1020YFFT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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