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XLMG3410RWHT - Texas Instruments

Description: 600-V 12-A Single Channel GaN Power Stage

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XLMG3410RWHT - Texas Instruments - PCB symbol
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PCB Footprints
XLMG3410RWHT - Texas Instruments PCB footprint - Other - Other - RWH0032A
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3D Models
XLMG3410RWHT - Texas Instruments - 3D model - Other - RWH0032A
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XLMG3410RWHT Details

  • Manufacturer Part Number:

    XLMG3410RWHT

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-32

  • ECCN Code:

    EAR99

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • DS Breakdown Voltage-Min:

    480 V

  • Drain Current-Max (ID):

    12 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PQCC-N32

  • Number of Terminals:

    32

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    32 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

XLMG3410RWHT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane and a separate power plane for the XLMG3410RWHT. The device should be placed near the center of the board, and the decoupling capacitors should be placed as close as possible to the device pins.
  • The XLMG3410RWHT requires a power-on reset (POR) circuit to ensure proper power-on and power-off sequencing. A POR circuit can be implemented using a voltage supervisor IC or a discrete circuit with a voltage detector and a reset generator.
  • The XLMG3410RWHT has a thermal pad that must be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB. Additionally, a heat sink or a thermal shield can be used to further reduce the junction temperature.
  • Texas Instruments recommends using a logic analyzer or an oscilloscope to troubleshoot issues with the XLMG3410RWHT. The device's debug interface can be used to access internal registers and debug information. Additionally, the XLMG3410RWHT has a built-in self-test (BIST) feature that can be used to diagnose issues.
  • The XLMG3410RWHT is a sensitive device that requires ESD protection during handling and assembly. Texas Instruments recommends using ESD-safe materials, such as ESD-safe trays and bags, and following proper ESD handling procedures to prevent damage to the device.

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XLMG3410RWHT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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