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XPS628660AYCGR - Texas Instruments

Description: 5.5-V, 6-A synchronous step-down converter with I2C interface in 1.05-mm × 1.78-mm WCSP package

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PCB Footprints
XPS628660AYCGR - Texas Instruments PCB footprint - BGA - BGA - YCG0015_2021
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XPS628660AYCGR - Texas Instruments  - 3D model - BGA - YCG0015_2021
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XPS628660AYCGR Details

  • Manufacturer Part Number:

    XPS628660AYCGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DSBGA-15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2019-07-13

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT IN ADJUSTABLE MODE 0.4V TO 1.675V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.4 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PBGA-B15

  • JESD-609 Code:

    e1

  • Length:

    2.255 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA15(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.625 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.344 mm

XPS628660AYCGR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the XPS628660AYCGR datasheet, which includes a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (TJ) of 150°C. Proper thermal design, including a heat sink and thermal interface material, can help reduce the junction temperature. Additionally, consider using a thermal monitoring system to detect overheating conditions.
  • The internal voltage regulator of the XPS628660AYCGR has limitations, including a maximum output current of 50 mA and a dropout voltage of 1.5 V. It's essential to consider these limitations when designing the power supply and to ensure that the internal regulator can provide the required voltage and current for the system.
  • To optimize the power-on reset (POR) circuitry, ensure that the POR pin is properly connected to a capacitor and a pull-up resistor. The capacitor value should be chosen to provide a sufficient delay to allow the power supply to stabilize before the device becomes active. A typical value for the capacitor is 10 nF to 100 nF.
  • To minimize EMI and ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components. Additionally, consider using a metal shield or a conductive enclosure to reduce radiated emissions.

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XPS628660AYCGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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