XQ7A50T-L1CS325I - AMD

XQ7A50T-L1CS325I Details

• Manufacturer Part Number:

  XQ7A50T-L1CS325I

• Part Life Cycle Code:

  Active

• Package Description:

  BGA-324

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Manufacturer:

  AMD

• YTEOL:

  9

• Clock Frequency-Max:

  1098 MHz

• Combinatorial Delay of a CLB-Max:

  1.27 ns

• JESD-30 Code:

  S-PBGA-B324

• JESD-609 Code:

  e0

• Length:

  15 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  4075

• Number of Inputs:

  150

• Number of Logic Cells:

  52160

• Number of Outputs:

  150

• Number of Terminals:

  324

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  4075 CLBS

• Package Body Material:

  PLASTIC

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA324,18X18,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  225

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.5 mm

• Supply Voltage-Max:

  0.98 V

• Supply Voltage-Min:

  0.92 V

• Supply Voltage-Nom:

  0.95 V

• Surface Mount:

  YES

• Technology:

  HKMG

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  15 mm