XQ7Z030-1RF676Q - AMD

XQ7Z030-1RF676Q Details

• Manufacturer Part Number:

  XQ7Z030-1RF676Q

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-676

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B676

• JESD-609 Code:

  e0

• Length:

  27 mm

• Moisture Sensitivity Level:

  4

• Number of Terminals:

  676

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA676,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  225

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  3.37 mm

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  PROGRAMMABLE SoC