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XQR5VFX130-1CN1752B - AMD

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XQR5VFX130-1CN1752B - AMD - PCB symbol
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PCB Footprints
XQR5VFX130-1CN1752B - AMD PCB footprint - BGA - BGA - CN1752 BGA
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XQR5VFX130-1CN1752B - AMD - 3D model - BGA - CN1752 BGA
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XQR5VFX130-1CN1752B Details

  • Manufacturer Part Number:

    XQR5VFX130-1CN1752B

  • Part Life Cycle Code:

    Active

  • Package Description:

    CGA-1752

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    5.8

  • Combinatorial Delay of a CLB-Max:

    0.11 ns

  • JESD-30 Code:

    S-CBGA-X1752

  • Length:

    45 mm

  • Number of CLBs:

    10240

  • Number of Logic Cells:

    131072

  • Number of Terminals:

    1752

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Organization:

    10240 CLBS

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    CGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    8.8 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Form:

    UNSPECIFIED

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Dose:

    1M Rad(Si) V

  • Width:

    45 mm

XQR5VFX130-1CN1752B Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the XQR5VFX130-1CN1752B, which includes recommendations for PCB layout, thermal design, and heat sink attachment. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • The XQR5VFX130-1CN1752B has a complex power management system. AMD provides a power management guide that explains how to configure and optimize the device's power modes, voltage regulators, and clock domains. Additionally, the device's documentation includes registers and bit fields that control power management features.
  • The XQR5VFX130-1CN1752B's high-speed interfaces have specific requirements and limitations. For example, PCIe lanes have specific routing and termination requirements, and DDR4 memory interfaces require careful signal integrity analysis. AMD provides guidelines and recommendations for designing and implementing these interfaces in the device's documentation and application notes.
  • The XQR5VFX130-1CN1752B has a robust security architecture. AMD provides documentation and guidelines for implementing and optimizing the device's security features, including Secure Boot, TrustZone, and cryptographic accelerators. Additionally, AMD offers security-focused software development kits (SDKs) and tools to help developers integrate these features into their designs.
  • AMD provides a range of debugging and troubleshooting tools, including JTAG and serial console interfaces. The device's documentation includes guidelines for using these tools, as well as recommendations for debugging and troubleshooting complex peripherals and interfaces. Additionally, AMD offers online resources and community forums where developers can share knowledge and best practices.

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XQR5VFX130-1CN1752B Overview

Use the download button to access the XQR5VFX130-1CN1752B schematic symbol, PCB footprint, and 3D model.
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Part Image XQR5VFX130-1CN1752V AMD Xilinx

Field Programmable Gate Array, 10240 CLBs, 131072-Cell, CMOS, CBGA1752