XQZU3EG-1SFRC784M - AMD

XQZU3EG-1SFRC784M Details

• Manufacturer Part Number:

  XQZU3EG-1SFRC784M

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-784

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B784

• JESD-609 Code:

  e0

• Length:

  23 mm

• Moisture Sensitivity Level:

  4

• Number of Terminals:

  784

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA784,28X28,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  220

• Seated Height-Max:

  3.52 mm

• Supply Voltage-Max:

  0.892 V

• Supply Voltage-Min:

  0.808 V

• Supply Voltage-Nom:

  0.85 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Lead (Sn63Pb37)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  20

• Width:

  23 mm

• uPs/uCs/Peripheral ICs Type:

  PROGRAMMABLE SoC