XR16M581IB25-F - EXAR

XR16M581IB25-F Details

• Manufacturer Part Number:

  XR16M581IB25-F

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Exar Corporation

• YTEOL:

  0

• Boundary Scan:

  NO

• Communication Protocol:

  ASYNC, BIT

• JESD-30 Code:

  S-PBGA-B25

• JESD-609 Code:

  e3

• Number of Serial I/Os:

  1

• Number of Terminals:

  25

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA25,5X5,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Qualification Status:

  Not Qualified

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  4.5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• uPs/uCs/Peripheral ICs Type:

  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL