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XR17D152CM-F - MaxLinear, Inc.

Description: UART Interface IC 3.3V-5V 64B FIFO temp 0C to 70C; UART

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PCB Footprints
XR17D152CM-F - MaxLinear, Inc. PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP100
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3D Models
XR17D152CM-F - MaxLinear, Inc.  - 3D model - Quad Flat Packages - TQFP100
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XR17D152CM-F Details

  • Manufacturer Part Number:

    XR17D152CM-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    14 X 14 MM, 1 MM HEIGHT, GREEN, TQFP-100

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY AT 33MHZ

  • Address Bus Width:

    32

  • Boundary Scan:

    NO

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    50 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.78125 MBps

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR17D152CM-F Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note AN-215 from MaxLinear Inc. Additionally, ensure good thermal management by providing adequate heat dissipation paths and keeping the device away from heat sources.
  • For troubleshooting and debugging, use the evaluation board and development tools provided by MaxLinear Inc. These tools offer a range of diagnostic features and debugging capabilities to help identify and resolve issues quickly.
  • The recommended power sequencing is to power up the device in the following order: VCC, AVCC, and then DVCC. Ensure that the supply voltage is within the recommended range of 1.71V to 1.89V for optimal performance and reliability.
  • To optimize the device's performance, consult the application notes and design guides provided by MaxLinear Inc. These resources offer guidance on optimizing the device's performance for specific applications, including signal integrity, power management, and thermal management.
  • The XR17D152CM-F has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. Handle the device by the body, avoid touching the pins, and store the device in an anti-static bag or container.

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XR17D152CM-F Overview

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