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XR20M1170IG16TR-F - MaxLinear, Inc.

Description: UART Interface IC XR20M1170IG16TR-F

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XR20M1170IG16TR-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-16
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XR20M1170IG16TR-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - TSSOP-16
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XR20M1170IG16TR-F Details

  • Manufacturer Part Number:

    XR20M1170IG16TR-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    3

  • Boundary Scan:

    NO

  • Bus Compatibility:

    I2C; UART

  • Clock Frequency-Max:

    64 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    2 MBps

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of I/O Lines:

    8

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

XR20M1170IG16TR-F Frequently Asked Questions (FAQs)

  • MaxLinear provides a reference design guide and layout recommendations in their application notes. It's essential to follow these guidelines to ensure proper thermal management and signal integrity. Additionally, a 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended.
  • To optimize power consumption, consider using the device's power-down modes, adjusting the clock frequency, and optimizing the transmit and receive modes. MaxLinear provides power consumption estimates in the datasheet, but actual power consumption may vary depending on the specific application and usage.
  • The recommended PLL settings can be found in the datasheet and application notes. It's essential to follow these guidelines to ensure proper clocking and data transmission. Additionally, the device's clocking system can be configured using the provided software development kit (SDK) and API.
  • MaxLinear provides a range of debugging tools and resources, including a logic analyzer, oscilloscope, and software development kit (SDK). Engineers can use these tools to analyze the device's behavior, identify issues, and optimize performance. Additionally, MaxLinear's technical support team is available to provide assistance and guidance.
  • The XR20M1170IG16TR-F is rated for industrial temperature range (-40°C to 85°C) and can withstand various environmental conditions, including humidity and vibration. However, it's essential to follow proper storage and handling procedures to prevent damage and ensure reliability.

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XR20M1170IG16TR-F Overview

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