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XR21V1412IL32-F - MaxLinear, Inc.

Description: USB Interface IC 2-Ch 12Mbps 48MHz Internal clock; UART

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PCB Footprints
XR21V1412IL32-F - MaxLinear, Inc. PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 32-Pin QFN
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3D Models
XR21V1412IL32-F - MaxLinear, Inc.  - 3D model - Quad Flat No-Lead - 32-Pin QFN
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XR21V1412IL32-F Details

  • Manufacturer Part Number:

    XR21V1412IL32-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7.25

  • Bus Compatibility:

    I2C

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

XR21V1412IL32-F Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout and routing guidelines provided in the application note AN-215 from MaxLinear Inc. This includes using a 4-layer PCB, separating analog and digital grounds, and minimizing signal trace lengths.
  • To ensure reliable operation across the entire operating temperature range, it is recommended to follow the thermal management guidelines provided in the datasheet. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The recommended power sequencing and reset strategies for the XR21V1412IL32-F are outlined in the application note AN-213 from MaxLinear Inc. This includes powering up the device in a specific sequence, using a reset signal to initialize the device, and ensuring that the power supplies are stable before enabling the device.
  • To optimize the device's performance for your specific application, it is recommended to consult the application notes and design guides provided by MaxLinear Inc. These resources provide guidance on optimizing the device's performance for various applications, including data transmission, signal integrity, and power management.
  • To prevent damage from electrostatic discharge (ESD), it is recommended to follow the ESD protection and handling procedures outlined in the datasheet. This includes using ESD-safe materials, grounding oneself before handling the device, and storing the device in an ESD-safe environment.

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XR21V1412IL32-F Overview

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