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XR3072XID-F - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC Lo Pwr 18V Tolerant 3.3V Tnscvrs

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PCB Footprints
XR3072XID-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC8
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3D Models
XR3072XID-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC8
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XR3072XID-F Details

  • Manufacturer Part Number:

    XR3072XID-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3.9 mm

XR3072XID-F Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common mode filter to reduce EMI.
  • Use a reliable communication protocol such as SPI or I2C, and ensure proper signal termination and filtering. Also, use a common clock source and ensure the microcontroller is configured to match the XR3072XID-F's communication mode.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying the clock signal.
  • Consult the application notes and evaluation boards provided by MaxLinear Inc. Also, consider factors such as input impedance, output loading, and clock frequency to optimize the device's performance for your specific application.
  • The XR3072XID-F has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if the device will be operating in a high-temperature environment.

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XR3072XID-F Overview

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