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XR32330EBERTR-F - MaxLinear, Inc.

Description: RS-232 Interface IC RS-232 250kbps 3TX/5RX Transceiver

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PCB Footprints
XR32330EBERTR-F - MaxLinear, Inc. PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 24-Pin QFN (4x4mm)
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3D Models
XR32330EBERTR-F - MaxLinear, Inc.  - 3D model - Quad Flat No-Lead - 24-Pin QFN (4x4mm)
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XR32330EBERTR-F Details

  • Manufacturer Part Number:

    XR32330EBERTR-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-F; TIA-232-F

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Number of Functions:

    3

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    1 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

XR32330EBERTR-F Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended for the top and bottom layers. Additionally, ensure a minimum of 10mm clearance around the device for airflow and heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal protection devices, such as thermistors or thermal fuses, to prevent overheating. It's also crucial to follow proper PCB design and layout guidelines to minimize thermal resistance.
  • For EMI compliance, it's recommended to use a pi-filter (C-L-C) or a common-mode choke at the input and output stages. The filter components should be selected based on the specific application's frequency range and impedance requirements. Additionally, ensure that the PCB layout is designed to minimize radiation and conducted emissions.
  • To troubleshoot and debug issues with the XR32330EBERTR-F, use a systematic approach to identify the root cause. Start by verifying the power supply and input voltage, then check the output voltage and current. Use oscilloscopes and logic analyzers to monitor the device's behavior. Consult the datasheet and application notes for specific troubleshooting guidelines and debug techniques.
  • For soldering and rework, follow the recommended soldering profile and temperature guidelines to prevent damage to the device. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the soldering time is within 3-5 seconds. For rework, use a hot air rework station with a temperature range of 180°C to 200°C, and follow the manufacturer's guidelines for component removal and replacement.

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XR32330EBERTR-F Overview

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