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XR33058HD-F - MaxLinear, Inc.

Description: Single Transmitter/Receiver RS-422/RS-485 8-Pin SOIC N Tube

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PCB Footprints
XR33058HD-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC-8
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3D Models
XR33058HD-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC-8
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XR33058HD-F Details

  • Manufacturer Part Number:

    XR33058HD-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.65 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    TRUE AND INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    1600 ns

  • Width:

    3.9 mm

XR33058HD-F Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common mode filter to reduce EMI.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF) for power decoupling, and place it as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range.
  • Use a high-quality, low-jitter clock source (e.g., a crystal oscillator) and ensure the clock signal is properly terminated and routed to minimize signal degradation.
  • Use the device's power-down modes, reduce the clock frequency when possible, and optimize the system's power management strategy to minimize power consumption.
  • Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Keep the device within the recommended operating temperature range.

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XR33058HD-F Overview

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