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XR33156ID-F - MaxLinear, Inc.

Description: Single Transmitter/Receiver RS-422/RS-485 14-Pin SOIC N Tube

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PCB Footprints
XR33156ID-F - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC14
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XR33156ID-F - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC14
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XR33156ID-F Details

  • Manufacturer Part Number:

    XR33156ID-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.0004 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.65 mm

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.85 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    60 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    25 ns

  • Width:

    3.9 mm

XR33156ID-F Frequently Asked Questions (FAQs)

  • MaxLinear provides a recommended PCB layout and thermal management guide in their application note AN-215, which includes guidelines for thermal pad connection, heat sink attachment, and PCB layer stack-up to ensure optimal performance and thermal dissipation.
  • To optimize the XR33156ID-F for low power consumption, engineers can use the device's built-in power-saving features such as the low-power mode, disable unused functions, and adjust the clock frequency. Additionally, optimizing the external circuitry and using low-power external components can also help reduce overall power consumption.
  • MaxLinear recommends following standard ESD protection and handling procedures, such as using anti-static wrist straps, mats, and bags, and handling the device by the body rather than the pins. Additionally, the device should be stored in a dry, cool place, away from direct sunlight and moisture.
  • To troubleshoot common issues such as oscillations or instability in the output signal, engineers can use tools such as oscilloscopes and spectrum analyzers to analyze the signal. They can also check the device's operating conditions, such as voltage and temperature, and ensure that the device is properly configured and biased. MaxLinear also provides application notes and technical support to help troubleshoot and resolve issues.
  • The XR33156ID-F meets industry-standard reliability and quality standards, including AEC-Q100 for automotive applications, and is manufactured in accordance with MaxLinear's quality management system, which is certified to ISO 9001:2015. The device is also backed by MaxLinear's warranty and support policies.

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XR33156ID-F Overview

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