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XR33202EEHBTR-F - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC Wide Supply Trans with I/O Interface

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PCB Footprints
XR33202EEHBTR-F - MaxLinear, Inc. PCB footprint - Small Outline No-lead - Small Outline No-lead - 3mm x 3mm DFN
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3D Models
XR33202EEHBTR-F - MaxLinear, Inc.  - 3D model - Small Outline No-lead - 3mm x 3mm DFN
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XR33202EEHBTR-F Details

  • Manufacturer Part Number:

    XR33202EEHBTR-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000125 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    S-PDSO-N10

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Receive Delay-Max:

    50 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    0.6 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transmit Delay-Max:

    30 ns

  • Width:

    3 mm

XR33202EEHBTR-F Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the analog and digital grounds separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, ensure good thermal management by providing adequate airflow and using a heat sink if necessary.
  • To optimize power consumption, consider using the device's power-down modes, adjusting the clock frequency, and optimizing the output voltage. Additionally, consider using the device's built-in power-saving features, such as the low-power mode, and optimizing the system's overall power architecture.
  • To prevent damage from electrostatic discharge (ESD), handle the device by the body or use an ESD wrist strap, and store the device in an anti-static bag or container. Follow proper ESD handling procedures, such as grounding yourself before handling the device, and using an ESD-safe workstation.
  • To troubleshoot common issues, start by verifying the PCB layout and component values, ensuring that the device is properly decoupled and that the power supply is stable. Check for oscillations or instability by monitoring the output voltage and current, and adjust the compensation network or output filter as needed.
  • To ensure the XR33202EEHBTR-F meets your application's requirements, perform thorough testing and validation, including functional testing, performance testing, and environmental testing. Verify the device's output voltage, current, and power consumption, and validate the device's operation across the specified temperature range.

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XR33202EEHBTR-F Overview

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