XRCGE26M000FBA2AR0 - Murata Electronics

XRCGE26M000FBA2AR0 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for XRCGE26M000FBA2AR0?
  Murata recommends a land pattern with a pad size of 2.5mm x 1.5mm, and a spacing of 1.5mm between pads. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
• How do I handle the XRCGE26M000FBA2AR0 during assembly to prevent damage?
  Handle the component by the edges or the body, avoiding touching the terminals or the ceramic body. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the component during assembly.
• What is the maximum operating temperature range for XRCGE26M000FBA2AR0?
  The maximum operating temperature range for XRCGE26M000FBA2AR0 is -40°C to +125°C. However, it's essential to note that the component's performance may degrade at extreme temperatures, and the recommended operating temperature range is -20°C to +85°C.
• Can I use XRCGE26M000FBA2AR0 in a high-vibration environment?
  Yes, the XRCGE26M000FBA2AR0 is designed to withstand vibrations up to 10G (10 times the acceleration due to gravity). However, it's crucial to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
• How do I store XRCGE26M000FBA2AR0 components to maintain their shelf life?
  Store the components in their original packaging or in a dry, cool place (less than 30°C and 60% relative humidity). Avoid exposing the components to direct sunlight, moisture, or extreme temperatures. Follow the recommended storage conditions to maintain the component's shelf life.