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XTDA4VMXXXGALF - Texas Instruments

Description: Texas Instruments Next generation SoC family for L2/L3, near-field analytic systems using deep learning technologies 827-FCBGA -40 to 125

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XTDA4VMXXXGALF - Texas Instruments PCB footprint - BGA - BGA - ALF0827A
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XTDA4VMXXXGALF - Texas Instruments  - 3D model - BGA - ALF0827A
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XTDA4VMXXXGALF Details

  • Manufacturer Part Number:

    XTDA4VMXXXGALF

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2020-01-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Bit Size:

    64

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    27 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B827

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Number of Terminals:

    827

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA827,29X29,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • RAM (words):

    5242880

  • Seated Height-Max:

    2.8 mm

  • Speed:

    1000 MHz

  • Supply Voltage-Max:

    0.84 V

  • Supply Voltage-Min:

    0.77 V

  • Supply Voltage-Nom:

    0.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

XTDA4VMXXXGALF Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and using decoupling capacitors.
  • To optimize power consumption, use the lowest possible clock frequency, disable unused peripherals, and use power-saving modes like idle or sleep modes. Additionally, consider using a power management IC to regulate voltage and reduce power consumption.
  • The XTDA4VMXXXGALF has a maximum junction temperature of 125°C. Ensure good airflow, use a heat sink if necessary, and follow thermal design guidelines to prevent overheating. Monitor temperature using the on-chip temperature sensor.
  • Follow good EMC design practices, such as using a metal shield, minimizing signal trace lengths, and using EMI filters. Ensure that the PCB layout and component placement minimize radiation and susceptibility to electromagnetic interference.
  • The ADC in XTDA4VMXXXGALF is sensitive to noise and interference. Ensure proper analog signal routing, use a dedicated analog power supply, and follow the recommended ADC configuration and calibration procedures.

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XTDA4VMXXXGALF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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