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XTPS56339DDCR - Texas Instruments

Description: 4.5-V to 24-V input, 3-A output synchronous step-down converter

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PCB Footprints
XTPS56339DDCR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DDC0006A
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3D Models
XTPS56339DDCR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DDC0006A
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XTPS56339DDCR Details

  • Manufacturer Part Number:

    XTPS56339DDCR

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 6 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-11-28

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    OUTPUT VOLTAGE IN ADJUSTABLE MODE IS 0.8V TO 16V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    610 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

XTPS56339DDCR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good thermal design practices, such as using a solid ground plane, minimizing thermal resistance, and using thermal vias to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's crucial to follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or thermal management system. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
  • Operating the device at the maximum junction temperature (TJ) of 150°C can reduce its lifespan and reliability. It's recommended to operate the device at a lower temperature to ensure optimal performance and longevity. A general rule of thumb is to keep the junction temperature at least 20°C below the maximum rating.
  • The XTPS56339DDCR has specific power sequencing requirements to ensure proper operation. It's essential to follow the recommended power-up and power-down sequences, as outlined in the datasheet, to prevent damage to the device or other components in the system.
  • When using the XTPS56339DDCR in a high-reliability or safety-critical application, it's crucial to follow Texas Instruments' guidelines for reliability and safety. This includes using the device within its recommended operating conditions, following proper design and manufacturing practices, and implementing suitable fault detection and mitigation strategies.

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XTPS56339DDCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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