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XTR111AIDGQT - Texas Instruments

Description: Precision Voltage-To-Current XTR111AIDGQT, Current Sensing Amplifier 10-Pin HTSSOP EP

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XTR111AIDGQT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGQ0010D
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XTR111AIDGQT - Texas Instruments  - 3D model - Small Outline Packages - DGQ0010D
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XTR111AIDGQT Details

  • Manufacturer Part Number:

    XTR111AIDGQT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.55 mA

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    8 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

XTR111AIDGQT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the device placed close to the load, and the input and output capacitors placed as close as possible to the device. A 4-layer PCB with a solid ground plane is recommended to minimize noise and EMI.
  • To ensure SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal design and layout techniques to minimize thermal resistance. Also, ensure the input voltage is within the recommended range, and the output current is within the specified maximum rating.
  • Use a thermal pad or heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good thermal contact between the device and the heat sink. Use thermal interface materials (TIMs) to fill gaps and reduce thermal resistance. Keep the heat sink away from other components to minimize thermal coupling.
  • Use a shielded enclosure, and ensure the PCB layout is optimized for EMI reduction. Use a common-mode choke or ferrite bead on the input and output lines. Keep the device and its associated components away from other noise-sensitive components. Use a 4-layer PCB with a solid ground plane to minimize radiation.
  • Use low-ESR capacitors with a voltage rating of at least 1.5 times the maximum input voltage. For the input capacitor, a 10-22 μF ceramic or film capacitor is recommended. For the output capacitor, a 10-47 μF ceramic or film capacitor is recommended.

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XTR111AIDGQT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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