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Z0103NN0,135 - NXP

Description: Direct interfacing to logic level ICs „ Enhanced current surge capability „ Enhanced noise immunity „ High blocking voltage of 800V „ Planar passivated for voltage ruggedness and reliability „ Surface-mountable package „ Triggering in all four quadrants „ Very sensitive gate in four quadrants

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Symbol
Z0103NN0,135 - NXP - PCB symbol
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PCB Footprints
Z0103NN0,135 - NXP PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT223*
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3D Models
Z0103NN0,135 - NXP - 3D model - SOT223 (3-Pin) - SOT223*
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Z0103NN0,135 Details

  • Manufacturer Part Number:

    Z0103NN0,135

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SC-73

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • ECCN Code:

    EAR99

  • Manufacturer:

    NXP Semiconductors

  • Critical Rate of Rise of Commutation Voltage-Min:

    0.5 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    80 V/us

  • DC Gate Trigger Current-Max:

    3 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    7 mA

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Peak Reflow Temperature (Cel):

    260

  • RMS On-state Current-Max:

    1 A

  • Repetitive Peak Off-state Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Device Type:

    TRIAC

Z0103NN0,135 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the layout symmetrical and avoid vias under the device. Refer to NXP's application note AN11538 for more details.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots. The device is rated for operation up to 150°C, but derating may be necessary for high-temperature applications.
  • Use a shielded enclosure, and ensure good grounding and bonding. Implement EMI filters and shielding on cables. Follow NXP's guidelines for PCB layout and component placement to minimize radiation.
  • Use NXP's development boards and evaluation kits to test and validate the device. Utilize oscilloscopes and logic analyzers to debug signal integrity issues. Consult NXP's application notes and technical support resources for guidance.
  • The device meets various safety standards, including IEC 61508 and ISO 26262. However, it's essential to follow NXP's safety guidelines and consult with a safety expert to ensure compliance with relevant regulations and standards.

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Z0103NN0,135 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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