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Z2SMB18 - Diotec

Description: Zener Diodes Zener, SMB, 18V, 2W, 5%

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Symbol
Z2SMB18 - Diotec - PCB symbol
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PCB Footprints
Z2SMB18 - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMB~DO-214AA_2023
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3D Models
Z2SMB18 - Diotec - 3D model - Diodes Moulded - SMB~DO-214AA_2023
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Z2SMB18 Details

  • Manufacturer Part Number:

    Z2SMB18

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.27

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    15 Ω

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    2 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

Z2SMB18 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the device, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and components away from the thermal pad can improve thermal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the Z2SMB18 on the PCB. Use a reflow oven or a hot air gun to solder the device. Make sure to follow the recommended soldering profile and avoid overheating the device.
  • The maximum allowed voltage derating for the Z2SMB18 is typically 10% to 15% below the maximum rated voltage. This is to ensure reliable operation and prevent damage to the device. However, it's recommended to consult with the manufacturer or a qualified engineer to determine the specific derating requirements for your application.
  • The Z2SMB18 is designed for low-frequency switching applications. While it can be used in high-frequency switching applications, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that it meets the requirements of your specific application. You may need to add additional components, such as snubbers or filters, to mitigate high-frequency effects.
  • To protect the Z2SMB18 from EOS and ESD, use proper handling and storage procedures, such as using anti-static bags and wrist straps. In the circuit design, consider adding protection components, such as TVS diodes or ESD protection devices, to absorb voltage transients and prevent damage to the device.

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Z2SMB18 Overview

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Z2SMB18 Alternates

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For a full list of alternate parts for Z2SMB18, check out Findchips.com