HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, PLASTIC, Z4-D, 4 PIN
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Comchip Technology Corporation Ltd
YTEOL:
0
Additional Feature:
LOW POWER LOSS
Configuration:
BRIDGE, 4 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF):
0.95 V
JESD-30 Code:
R-PDSO-N4
JESD-609 Code:
e3
Non-rep Pk Forward Current-Max:
150 A
Number of Elements:
4
Number of Phases:
1
Number of Terminals:
4
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
4 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Rep Pk Reverse Voltage-Max:
600 V
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Z4DGP406L-HF Frequently Asked Questions (FAQs)
A good PCB layout for the Z4DGP406L-HF would involve keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
To prevent ESD damage, handle the Z4DGP406L-HF in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and use ESD-safe packaging and storage materials. Also, avoid touching the device's pins or leads, and use a soldering iron with an ESD-safe tip.
Yes, the Z4DGP406L-HF can be used in switching power supply applications. However, it's essential to ensure that the device is operated within its recommended operating conditions, and that the circuit is designed to minimize electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues.
When paralleling multiple Z4DGP406L-HF devices, ensure that each device has its own decoupling capacitors, and that the devices are matched in terms of their electrical characteristics. Also, consider the current sharing and thermal management of the devices, and ensure that the PCB layout is designed to minimize current imbalance and thermal gradients.
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Z4DGP406L-HF Overview
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