Z8523L16VEG footprint, schematic symbol and 3D model by LITTELFUSE

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PCB Footprints

Z8523L16VEG - LITTELFUSE PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - 44-pin Plastic Leaded Chip Carrier (PLCC) package_2021

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Datasheet Download Datasheet
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Part Number Z8523L16VEG
Manufacturer LITTELFUSE
Pin Count 44
Part Category Integrated Circuit
Package Category Plastic Leaded Chip Carrier
Footprint Name Plastic Leaded Chip Carrier - 44-pin Plastic Leaded Chip Carrier (PLCC) package_2021
Released Date Apr 14, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

Z8523L16VEG Details

Manufacturer Part Number:
Z8523L16VEG
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
GREEN, PLASTIC, LCC-44
HTS Code:
8542.31.00.30
Manufacturer:
Littelfuse Inc
YTEOL:
0
Boundary Scan:
NO
Bus Compatibility:
Z-BUS
Clock Frequency-Max:
16 MHz
Communication Protocol:
ASYNC, BIT; SYNC, HDLC; SYNC, SDLC; BISYNC
Data Encoding/Decoding Method:
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
External Data Bus Width:
8
JESD-30 Code:
S-PQCC-J44
Length:
16.585 mm
Low Power Mode:
NO
Number of Serial I/Os:
2
Number of Terminals:
44
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCJ
Package Equivalence Code:
LDCC44,.7SQ
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Qualification Status:
Not Qualified
Seated Height-Max:
4.57 mm
Supply Current-Max:
6 mA
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Form:
J BEND
Terminal Pitch:
1.27 mm
Terminal Position:
QUAD
Width:
16.585 mm
uPs/uCs/Peripheral ICs Type:
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Z8523L16VEG Frequently Asked Questions (FAQs)

For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots on the PCB.
When paralleling multiple devices for higher current handling, it is essential to ensure that each device has an identical thermal environment and is connected in a way that minimizes current imbalance. This can be achieved by using a common heat sink, identical PCB traces, and ensuring that the devices are matched in terms of their electrical characteristics.
To protect the device from EOS and ESD, it is recommended to use a TVS (transient voltage suppressor) diode or a zener diode in parallel with the device. Additionally, follow proper handling and storage procedures to prevent ESD damage, and use an ESD mat or wrist strap when handling the device.
In high-reliability or safety-critical applications, it is essential to follow the recommended design and qualification guidelines for the device. This includes performing thorough testing and validation, using a robust PCB design, and ensuring that the device is operated within its recommended specifications. Additionally, consider using redundant or fault-tolerant designs to ensure continued operation in the event of a failure.

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Z8523L16VEG Overview

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