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ZL30116GGG2V2 - Microchip

Description: SONET/SDH, Stratum IC 622.08MHz 1 Output 100-CABGA (9x9) 2.97V ~ 3.63V 622.08MHz ,-40°C ~ 85°C

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ZL30116GGG2V2 - Microchip PCB footprint - BGA - BGA - 100 ball 9 x 9mm,0.8 mm Pitch,4 layer, CABGA
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ZL30116GGG2V2 - Microchip  - 3D model - BGA - 100 ball 9 x 9mm,0.8 mm Pitch,4 layer, CABGA
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  • Datasheet
  • Stock & Prices $ Price & Stock for ZL30116GGG2V2
  • Part Number ZL30116GGG2V2
  • Manufacturer Microchip
  • Pin Count 100
  • Part Category Integrated Circuit
  • Package Category BGA
  • Footprint Name BGA - 100 ball 9 x 9mm,0.8 mm Pitch,4 layer, CABGA
  • Released Date Oct 17, 2025
  • Last Modified Date Oct 17, 2025 8:10 AM UTC
  • Pinout / Pin List Click Here (Member Only)

ZL30116GGG2V2 Details

  • Manufacturer Part Number:

    ZL30116GGG2V2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    100

  • Manufacturer Package Code:

    LFBGA-100

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Applications:

    SDH; SONET

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA100,10X10,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.72 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ATM/SONET/SDH SUPPORT CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

ZL30116GGG2V2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZL30116GGG2V2 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the clock signal traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the ZL30116GGG2V2, use a high-quality power supply with low noise and ripple. Add decoupling capacitors (e.g., 10uF and 100nF) close to the device's power pins, and use a 10kΩ resistor in series with the power supply to prevent voltage spikes.
  • The recommended clock source for the ZL30116GGG2V2 is a high-quality, low-jitter clock source, such as a crystal oscillator or a high-stability clock generator. Avoid using a clock source with high jitter or phase noise, as it can affect the device's performance.
  • To configure the ZL30116GGG2V2 for optimal jitter performance, set the device to use an external clock source, and ensure the clock signal is clean and stable. Also, adjust the device's internal clock multiplier and divider settings to minimize jitter accumulation.
  • The maximum operating temperature range for the ZL30116GGG2V2 is -40°C to +85°C. However, it's recommended to operate the device within a narrower temperature range (e.g., 0°C to +70°C) to ensure optimal performance and reliability.

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ZL30116GGG2V2 Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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