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ZL30261LDG1 - Microsemi Corporation

Description: Clock Generators & Support Products 6-Outputs Internal EEPROM

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ZL30261LDG1 - Microsemi Corporation - PCB symbol
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PCB Footprints
ZL30261LDG1 - Microsemi Corporation PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN56
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3D Models
ZL30261LDG1 - Microsemi Corporation - 3D model - Quad Flat No-Lead - QFN56
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ZL30261LDG1 Details

  • Manufacturer Part Number:

    ZL30261LDG1

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    QFN-56

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2016-09-26

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY

  • Family:

    30261

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    S-XQCC-N56

  • Length:

    8 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Power Supply Current-Max (ICC):

    682 mA

  • Propagation Delay (tpd):

    3.8 ns

  • Same Edge Skew-Max (tskwd):

    0.1 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • fmax-Min:

    1045 MHz

ZL30261LDG1 Frequently Asked Questions (FAQs)

  • Microsemi provides a recommended PCB layout in the ZL30261LDG1 evaluation board user guide, which includes guidelines for component placement, routing, and thermal management.
  • The ZL30261LDG1 can be configured for a specific clock frequency using the device's register settings. Refer to the device's programming guide and register map for more information.
  • The maximum power consumption of the ZL30261LDG1 depends on the specific application and operating conditions. However, according to the datasheet, the typical power consumption is around 1.5W. It's recommended to consult the datasheet and perform power calculations based on the specific use case.
  • Yes, the ZL30261LDG1 is designed to meet the requirements of radiation-hardened applications. It is fabricated using a radiation-hardened process and has been tested to withstand total ionizing dose (TID) and single-event effects (SEE). However, it's recommended to consult with Microsemi's radiation-hardened experts to ensure the device meets the specific requirements of the application.
  • The lead time for the ZL30261LDG1 may vary depending on the quantity, packaging, and availability. It's recommended to check with Microsemi's sales team or authorized distributors for the most up-to-date lead time information.

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ZL30261LDG1 Overview

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