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ZL30263LDG1 - Microchip

Description: Clock Generator 9.72MHz to 1.25GHz-IN 1045MHz-OUT 56-Pin QFN EP Tray

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ZL30263LDG1 - Microchip - PCB symbol
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PCB Footprints
ZL30263LDG1 - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 56-Lead Very Thin Plastic Quad Flat, No Lead Package (MEC) - 8x8x1 mm Body [VQFN]
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3D Models
ZL30263LDG1 - Microchip - 3D model - Quad Flat No-Lead - 56-Lead Very Thin Plastic Quad Flat, No Lead Package (MEC) - 8x8x1 mm Body [VQFN]
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ZL30263LDG1 Details

  • Manufacturer Part Number:

    ZL30263LDG1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-56

  • Pin Count:

    56

  • Manufacturer Package Code:

    VQFN-56

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • JESD-30 Code:

    S-PQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    1045 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Primary Clock/Crystal Frequency-Nom:

    1250 MHz

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    682 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROGRAMMABLE

ZL30263LDG1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZL30263LDG1 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To optimize the performance of the ZL30263LDG1 in a noisy environment, use a low-pass filter on the input, add a shield around the device, and use a ground plane to reduce electromagnetic interference (EMI). Additionally, use a ferrite bead or a common-mode choke to filter out high-frequency noise.
  • The maximum power dissipation of the ZL30263LDG1 is dependent on the thermal resistance of the package and the ambient temperature. According to the datasheet, the maximum power dissipation is 1.4W at 70°C ambient temperature. However, this value can be derated based on the specific application and operating conditions.
  • The ZL30263LDG1 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the device's power dissipation and operating frequency at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the ZL30263LDG1, start by checking the power supply voltage, clock signal, and input signals. Use an oscilloscope to verify the signal integrity and check for any signs of noise or distortion. Also, check the PCB layout and ensure that it meets the recommended layout guidelines.

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ZL30263LDG1 Overview

Use the download button to access the ZL30263LDG1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ZL302, or try a keyword search, such as Clock Generators

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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