8 X 8 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, MO-220, QFN-56
Pin Count:
56
HTS Code:
8542.39.00.01
Manufacturer:
Microsemi Corporation (now Microchip)
Filter:
YES
JESD-30 Code:
S-XQCC-N56
JESD-609 Code:
e3
Length:
8 mm
Number of Functions:
1
Number of Terminals:
56
Operating Mode:
ASYNCHRONOUS
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max:
1 mm
Supply Voltage-Nom:
1.2 V
Surface Mount:
YES
Telecom IC Type:
PCM CODEC
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Width:
8 mm
ZL38012LDG1 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) between VCC and GND, and place it close to the device.
The ZL38012LDG1 is a highly configurable device. Refer to the Microsemi Corporation's application notes and design guides for specific audio applications, such as audio codecs, ASRCs, and audio interfaces. These resources provide detailed configuration guidelines and example code.
The ZL38012LDG1 has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape or thermal grease) between the thermal pad and a heat sink or a metal plate on the PCB. Keep the device away from heat sources and ensure good airflow.
Use a logic analyzer or an oscilloscope to debug the digital signals. Check the clock signals, data lines, and control signals. Verify that the device is properly configured and that the audio data is correctly formatted. Consult the datasheet and application notes for troubleshooting guidelines.
Yes, the ZL38012LDG1 is a high-frequency device and requires proper EMI/EMC design considerations. Use a shielded enclosure, keep the device away from antennas and other EMI sources, and ensure good PCB layout practices, such as using a solid ground plane and minimizing signal loop areas.
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ZL38012LDG1 Overview
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