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ZL40217LDG1 - Microsemi Corporation

Description: • Accepts differential or single-ended input • LVPECL, LVDS, CML, HCSL, LVCMOS • On-chip input termination and biasing for AC coupled inputs • Six precision LVDS outputs • Operating frequency up to 750 MHz

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ZL40217LDG1 - Microsemi Corporation - PCB symbol
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ZL40217LDG1 - Microsemi Corporation PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - .32 QFN PACKAGE OUTLINE 5X5X0.90MM
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ZL40217LDG1 - Microsemi Corporation - 3D model - Quad Flat No-Lead - .32 QFN PACKAGE OUTLINE 5X5X0.90MM
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ZL40217LDG1 Details

  • Manufacturer Part Number:

    ZL40217LDG1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    QFN

  • Package Description:

    QFN-32

  • Pin Count:

    32

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY

  • Family:

    4000/14000/40000

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N32

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Propagation Delay (tpd):

    2 ns

  • Same Edge Skew-Max (tskwd):

    0.15 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.375 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

ZL40217LDG1 Frequently Asked Questions (FAQs)

  • Microsemi provides a recommended PCB layout guide in their application note AN-803, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The ZL40217LDG1 requires a specific power-up sequence to ensure proper initialization. Refer to the datasheet section 8.1 for the recommended power-up sequence, and ensure that the EN pin is properly driven to enable the device.
  • While the datasheet specifies the recommended operating voltage range, it's essential to note that the device can tolerate a maximum of 10% overshoot on the input voltage pins for a duration of less than 100 ns. Exceeding this limit may cause damage to the device.
  • To troubleshoot clock output issues, first verify that the device is properly powered and initialized. Check the clock output frequency and amplitude using an oscilloscope, and ensure that the load capacitance is within the recommended range. If issues persist, consult the datasheet section 10 for troubleshooting guidelines.
  • To minimize EMI, use a multi-layer PCB with a solid ground plane, and ensure that the device is placed away from noise sources. Use shielded cables for clock output connections, and consider adding EMI filters or chokes to the input power lines. Refer to the datasheet section 11 for additional EMI mitigation guidelines.

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ZL40217LDG1 Overview

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