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ZSC31050FAG1-R - Renesas Electronics

Description: The ZSC31050 is a CMOS integrated circuit for amplification and sensor-specific correction of bridge sensor signals. The device provides digital compensation of sensor offset, sensitivity, temperature drift and non-linearity by a 16-bit RISC microcontroller running a correction algorithm. The ZSC31050 accommodates virtually any resistive bridge sensor (e.g., piezo-resistive and steel-membrane-based pressure sensors). In addition, the device can interface to a separate temperature sensor. The bi-directional

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ZSC31050FAG1-R - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PYG16_5.3mmSSOP
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ZSC31050FAG1-R - Renesas Electronics  - 3D model - Small Outline Packages - PYG16_5.3mmSSOP
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ZSC31050FAG1-R Details

  • Manufacturer Part Number:

    ZSC31050FAG1-R

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PYG16

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Interface IC Type:

    DIFFERENTIAL SENSOR SIGNAL CONDITIONER

  • JESD-30 Code:

    R-PDSO-G16

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

ZSC31050FAG1-R Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZSC31050FAG1-R involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • Calibration of the ZSC31050FAG1-R involves adjusting the internal offset and gain registers to compensate for any deviations from the ideal transfer function. This can be done using the device's built-in calibration registers or through external calibration using a microcontroller or other external device.
  • The recommended power-up sequence for the ZSC31050FAG1-R is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and finally the clock signal. This ensures that the device powers up correctly and minimizes the risk of latch-up or other power-related issues.
  • ESD protection for the ZSC31050FAG1-R can be achieved through the use of external ESD protection devices, such as TVS diodes or ESD arrays, connected to the device's input pins. Additionally, it's recommended to follow proper PCB design and handling practices to minimize the risk of ESD damage.
  • The ZSC31050FAG1-R is rated for operation over a temperature range of -40°C to 125°C. However, it's recommended to operate the device within a narrower temperature range (e.g. 0°C to 85°C) to ensure optimal performance and accuracy.

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ZSC31050FAG1-R Overview

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