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ZSSC3241DI3W - Renesas Electronics

Description: The ZSSC3241 is a sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of resistive sensor signals. The ZSSC3241 provides best-in-class sensor-element adaptability, and it is suitable for bridge and half-bridge sensors, as well as external voltage-source element and single-element sensors in multiple configurations. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 26-bit math core

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ZSSC3241DI3W - Renesas Electronics - PCB symbol
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PCB Footprints
ZSSC3241DI3W - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG24-ren2
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3D Models
ZSSC3241DI3W - Renesas Electronics - 3D model - Quad Flat No-Lead - NLG24-ren2
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ZSSC3241DI3W Details

  • Manufacturer Part Number:

    ZSSC3241DI3W

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    TIN

ZSSC3241DI3W Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the analog and digital sections separate, and use a ferrite bead or a 10uF capacitor to filter the power supply.
  • Calibration involves trimming the internal voltage reference and the ADC gain. Use the provided calibration software or follow the calibration procedure outlined in the application note to achieve optimal accuracy.
  • The maximum allowed ambient temperature for the ZSSC3241DI3W is 125°C. However, the device can operate up to 150°C with reduced accuracy and reliability.
  • Yes, the ZSSC3241DI3W is designed to operate in humid environments. However, it's essential to follow proper PCB design and assembly guidelines to prevent moisture-related issues.
  • Follow proper PCB design and layout guidelines, use a metal shield or a Faraday cage to enclose the device, and ensure proper grounding and decoupling to minimize electromagnetic interference.

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ZSSC3241DI3W Overview

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