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ZXM64P035L3 - Diodes Incorporated

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PCB Footprints
ZXM64P035L3 - Diodes Incorporated PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220-AB
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3D Models
ZXM64P035L3 - Diodes Incorporated  - 3D model - Transistor Outline, Vertical - TO220-AB
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ZXM64P035L3 Details

  • Manufacturer Part Number:

    ZXM64P035L3

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    35 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    19 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXM64P035L3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the ZXM64P035L3 is a standard SOT23 package with a 1.3mm x 1.3mm pad size, with a 0.5mm x 0.5mm thermal pad in the center.
  • To ensure proper biasing, connect the input pin to a voltage source through a 1kΩ to 10kΩ resistor, and decouple the input with a 10nF to 100nF capacitor. Also, ensure the output pin is connected to a load impedance of 1kΩ or higher.
  • The maximum power dissipation for the ZXM64P035L3 is 1.4W, assuming a junction temperature of 150°C and a thermal resistance of 125°C/W. However, it's recommended to derate the power dissipation to ensure reliable operation.
  • The ZXM64P035L3 is rated for operation up to 150°C, but it's essential to consider the device's thermal characteristics and ensure proper heat sinking to prevent overheating. Consult the datasheet for thermal resistance and junction-to-ambient thermal resistance values.
  • To protect the ZXM64P035L3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.

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ZXM64P035L3 Overview

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