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ZXMC4559DN8TA - Diodes Incorporated

Description: Diodes Inc ZXMC4559DN8TA Dual N/P-channel MOSFET Transistor, 8-Pin SOIC

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ZXMC4559DN8TA - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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ZXMC4559DN8TA - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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ZXMC4559DN8TA Details

  • Manufacturer Part Number:

    ZXMC4559DN8TA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3.6 A

  • Drain-source On Resistance-Max:

    0.055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMC4559DN8TA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMC4559DN8TA should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure stable operation with a varying input voltage, use a high-quality input capacitor (e.g., X7R or X5R) with a suitable voltage rating. Additionally, consider adding a voltage regulator or a voltage supervisor to regulate the input voltage and prevent brownout conditions.
  • The maximum allowable power dissipation for the ZXMC4559DN8TA is dependent on the ambient temperature and the thermal resistance of the PCB. As a general guideline, the device can dissipate up to 1.5W at 25°C ambient temperature. However, it's essential to perform thermal calculations and simulations to ensure the device operates within safe operating conditions.
  • The ZXMC4559DN8TA is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper design, testing, and validation. Ensure that your design meets the required industry standards (e.g., AEC-Q100) and that you follow the recommended operating conditions and guidelines.
  • To troubleshoot issues with the ZXMC4559DN8TA, start by verifying the input voltage, output voltage, and current consumption. Check for signs of overheating, electrical overstress, or physical damage. Use oscilloscopes or logic analyzers to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting and fault diagnosis.

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ZXMC4559DN8TA Overview

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