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ZXMP10A17GTA - Diodes Incorporated

Description: P-Channel MOSFET Transistor, 2.4 A, 100 V, 4-Pin SOT-223 Diodes Inc ZXMP10A17GTA

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ZXMP10A17GTA - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - ZXMP10A17GTA-
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ZXMP10A17GTA - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - ZXMP10A17GTA-
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ZXMP10A17GTA Details

  • Manufacturer Part Number:

    ZXMP10A17GTA

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-261AA

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.35 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-261AA

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.9 W

  • Pulsed Drain Current-Max (IDM):

    9.4 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP10A17GTA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMP10A17GTA should include a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a solid ground plane to reduce thermal resistance.
  • To ensure proper biasing, the ZXMP10A17GTA requires a stable input voltage (VIN) between 2.5V and 5.5V, and a stable output voltage (VOUT) set by the feedback resistors. A soft-start circuit can be added to prevent inrush currents during startup.
  • When selecting output capacitors for the ZXMP10A17GTA, consider the capacitor's equivalent series resistance (ESR), capacitance value, and voltage rating. A low-ESR capacitor with a capacitance value between 10uF to 22uF and a voltage rating of at least 6.3V is recommended.
  • To troubleshoot oscillations or instability issues, check the PCB layout for proper grounding, decoupling, and routing. Ensure the input and output capacitors are properly selected and placed. Also, verify the feedback loop is properly compensated, and the device is operated within its recommended operating conditions.
  • For high-temperature applications, the ZXMP10A17GTA's power dissipation must be derated to prevent overheating. A thermal derating curve can be used to determine the maximum allowed power dissipation at a given temperature. Ensure the device is properly heatsinked and the PCB is designed for optimal thermal performance.

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ZXMP10A17GTA Overview

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