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ZXMP10A17KTC - Diodes Incorporated

Description: MOSFET 100V P-Ch MOSFET 20V VGS -11.3A IDM

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ZXMP10A17KTC - Diodes Incorporated PCB footprint - Other - Other - ZXMP10A17KTC
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ZXMP10A17KTC Details

  • Manufacturer Part Number:

    ZXMP10A17KTC

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-252

  • Package Description:

    GREEN, PLASTIC PACKAGE-3

  • Pin Count:

    4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    LOW THRESHOLD

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.35 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    10.2 W

  • Pulsed Drain Current-Max (IDM):

    11.3 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP10A17KTC Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 2-ounce copper layer and to avoid routing high-current traces under the device.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid overheating the device.
  • The ZXMP10A17KTC has an ESD rating of Human Body Model (HBM) ±2kV and Machine Model (MM) ±200V. To prevent ESD damage, handle the device by the body or use an anti-static wrist strap. Store the device in an anti-static bag or container, and avoid touching the pins or leads during handling.
  • The ZXMP10A17KTC is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. If you need a device for such applications, consider using a device with a higher qualification level, such as AEC-Q101 or ISO 26262. Consult with Diodes Incorporated or a qualified engineer to determine the suitability of this device for your specific application.
  • The recommended soldering conditions for the ZXMP10A17KTC are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It's essential to follow these conditions to prevent damage to the device during the soldering process.

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ZXMP10A17KTC Overview

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