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ZXMP3A13FTA - Diodes Incorporated

Description: MOSFET P-Channel 30V 1.6A SOT23 Diodes Inc ZXMP3A13FTA P-channel MOSFET Transistor, 1.6 A, 30 V, 3-Pin SOT-23

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ZXMP3A13FTA - Diodes Incorporated - PCB symbol
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PCB Footprints
ZXMP3A13FTA - Diodes Incorporated PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - -SOT-23-2024aa-1
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3D Models
ZXMP3A13FTA - Diodes Incorporated - 3D model - SOT23 (3-Pin) - -SOT-23-2024aa-1
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ZXMP3A13FTA Details

  • Manufacturer Part Number:

    ZXMP3A13FTA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.21 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.806 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMP3A13FTA Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the Diodes Incorporated application note for more details.
  • To ensure stable operation, it is recommended to decouple the input voltage with a 10uF capacitor and add a 1uF capacitor in parallel with the output capacitor to filter out noise and ripple.
  • The maximum SOA is defined by the voltage and current ratings. Do not exceed 15V input voltage and 3A output current to prevent damage. Refer to the datasheet for the complete SOA graph.
  • The ZXMP3A13FTA is rated for operation up to 125°C junction temperature. However, derating is required for temperatures above 85°C. Refer to the datasheet for the thermal derating curve.
  • To minimize EMI, use a shielded inductor, keep the switching node (SW) as short as possible, and add a 10nF capacitor between the input and output grounds. Additionally, ensure good PCB layout practices, such as separating analog and digital grounds.

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ZXMP3A13FTA Overview

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