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ZXMS6005DN8-13 - Diodes Incorporated

Description: Self Protected Enhancement Mode Intelligent MOSFET

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ZXMS6005DN8-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 (10)xxxx
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ZXMS6005DN8-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8 (10)xxxx
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ZXMS6005DN8-13 Details

  • Manufacturer Part Number:

    ZXMS6005DN8-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    120 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain-source On Resistance-Max:

    0.25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.56 W

  • Pulsed Drain Current-Max (IDM):

    6 A

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

ZXMS6005DN8-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, with multiple vias connecting the thermal pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the device is properly biased, make sure to follow the recommended biasing circuit in the datasheet. This typically involves using a voltage regulator to provide a stable voltage supply, and using resistors to set the desired bias voltage.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) damage by using an ESD wrist strap or mat, and handling the device by the body rather than the pins. Also, avoid touching the pins or exposing the device to moisture.
  • To troubleshoot issues with the device, start by checking the power supply voltage and current, and ensuring that the device is properly biased. Check for any signs of physical damage or overheating, and verify that the device is properly soldered to the PCB.
  • Yes, the device should be stored in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to extreme temperatures, humidity, or physical stress.

Trust Checks

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ZXMS6005DN8-13 Overview

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