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ZXMS6006DT8TA - Diodes Incorporated

Description: MOSFET 60V Dual N-Ch Mosfet 100mOhm 2.8A 210mJ

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PCB Footprints
ZXMS6006DT8TA - Diodes Incorporated PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - ZXMS6006DT8TA-
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3D Models
ZXMS6006DT8TA - Diodes Incorporated  - 3D model - SOT23 (8-Pin) - ZXMS6006DT8TA-
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ZXMS6006DT8TA Details

  • Manufacturer Part Number:

    ZXMS6006DT8TA

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SM-8

  • Pin Count:

    8

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Additional Feature:

    CURRENT LIMIT:13A

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP8,.3,60

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q101

  • Seated Height-Max:

    1.7 mm

  • Supply Current-Max (Isup):

    0.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.53 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

ZXMS6006DT8TA Frequently Asked Questions (FAQs)

  • A good PCB layout for the ZXMS6006DT8TA should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour coverage around the device. Avoid routing high-current traces near the device to minimize thermal resistance.
  • To ensure stable operation with a varying input voltage, add input capacitors (e.g., 10uF ceramic) close to the device's input pins. This helps filter out voltage ripples and noise. Additionally, consider adding a voltage regulator or a voltage supervisor to regulate the input voltage.
  • The maximum allowed power dissipation for the ZXMS6006DT8TA is dependent on the ambient temperature and the device's thermal resistance. As a general guideline, the device can dissipate up to 1.5W at 25°C ambient temperature. However, it's essential to consult the datasheet and perform thermal calculations for your specific application.
  • The ZXMS6006DT8TA is a commercial-grade device, but it may not meet the stringent requirements of high-reliability or automotive applications. For such applications, consider using devices with higher reliability ratings, such as AEC-Q100 or MIL-STD-883 certified devices.
  • To protect the ZXMS6006DT8TA from overvoltage or overcurrent conditions, consider adding overvoltage protection (OVP) circuits, such as a voltage supervisor or a zener diode, and overcurrent protection (OCP) circuits, such as a current sense resistor and a comparator.

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ZXMS6006DT8TA Overview

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