375424B00034G price and availability options from Component Search Engine

DigiKey

HEATSINK PIN-FIN W/TAPE

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 375424B00034G-ND	BOYD Laconia	Bulk	1		Compliant	4207 Bulk	6720 $0.83861 3360 $0.87020 500 $0.96306 250 $0.99920 See More 100 $1.04900 50 $1.08820 25 $1.12920 10 $1.18500 1 $1.34000	Buy Now
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 92549930	Boyd Corporation		3360		Compliant	Americas - 3360	84000 $0.74650 67200 $0.75400 33600 $0.76160 16800 $0.76930 See More 10080 $0.77710 3360 $0.78500	Buy Now
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 88847975	Boyd Corporation		88		Compliant	Americas - 3260	88 $1.07860	Buy Now
Request or Build Model Download Datasheet							88 $1.07860

Heat Sink Passive BGA Pin Array Adhesive Plastic 62.5?C/W Black Anodized - Bulk (Alt: 042987)

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 042987	Amphenol Corporation	Bulk	1	6 Weeks, 0 Days	Compliant	3308	40320 $0.74375 20160 $0.76577 10080 $0.77676 6720 $0.83311 See More 1 $1.29690	Buy Now
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Heat Sink Passive BGA Pin Array Adhesive Plastic 62.5?C/W Black Anodized - Bulk (Alt: 375424B00034G)

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 375424B00034G	Amphenol Corporation	Bulk	3360		Compliant	0
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Heat Sinks Heat Sink for Plastic BGA Packages, Black, 15.2x15.2x6.4mm, IC=15x15, Tape #34

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 532-375424B00034G	BOYD Laconia				Compliant	5581	2500 $0.87100 500 $0.96400 250 $1.00000 100 $1.05000 See More 50 $1.09000 25 $1.13000 10 $1.19000 1 $1.33000	Buy Now
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # E02:0323_01989276	Boyd Corporation		3360	6 Weeks	Compliant	Europe - 3360	84000 $0.75410 67200 $0.76160 33600 $0.76940 16800 $0.77710 See More 10080 $0.78500 3360 $0.79300	Buy Now
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # V36:1790_07454366	Boyd Corporation		88	6 Weeks	Compliant	Americas - 3260	93 $1.07860	Buy Now
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EXTRUDED HEATSINK, 375424B00034G

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 75020461	Boyd Corporation	Bulk	3360	6 Weeks, 0 Days	Compliant	0	13440 $1.03000 6720 $1.06000 3360 $1.11000
Request or Build Model Download Datasheet							13440 $1.03000 6720 $1.06000 3360 $1.11000

BGA 62.5 C/W Thermal Resistance Plastic Black Anodize Heat Sink with Tape

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI #	Boyd Corporation	Tray	3360	16 Weeks	Compliant	0 Tray	500 $0.83000 250 $0.86500 125 $0.88000 50 $0.90000 See More 25 $0.91500	Buy Now
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI #	BOYD Laconia				Compliant	476 In Stock 3360 On Order	16800 $0.75500 10080 $0.75900 6720 $0.76300 3360 $0.76700 See More 1000 $0.77100 500 $0.77800 250 $0.82100 25 $1.12100	Buy Now
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HEAT SINK, FIN, PIN FIN ARRAY, OMNIDIRECT, ALUMINUM, ANODIZED

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI #	BOYD Laconia					2174	503 $3.62250 225 $3.98480 1 $7.24500	Buy Now
Request or Build Model Download Datasheet							503 $3.62250 225 $3.98480 1 $7.24500

Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 375424B00034G	Boyd Corporation		3360		Compliant	0	3360 $1.04000
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Heat Sink Passive BGA Pin Array Adhesive Plastic 625CW Black Anodized (Alt: 042987)

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI # 042987	Amphenol Corporation		3360	16 Weeks, 0 Days	Compliant	Abacus - 0
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The 375424B00034G is a square pin fin board-level heat sink designed for cooling BGA and FPGA devices.

MANUF PART NUMBER	MANUFACTURER	PACK SIZE	MIN ORDER QTY	LEAD TIME	ROHS	STOCK	PRICE	BUY
375424B00034G DISTI #	BOYD Laconia				Compliant	476 In Stock 3360 On Order	16800 $0.75500 10080 $0.75900 6720 $0.76300 3360 $0.76700 See More 1000 $0.77100 500 $0.77800 250 $0.82100 25 $1.12100	Buy Now
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